Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices

ABSTRACT

Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes through-vias, an integrated circuit die mounting region, and a material disposed around and between the through-vias and the integrated circuit die mounting region. An interconnect structure is disposed over the material, the through-vias, and the integrated circuit die mounting region. The interconnect structure includes a dummy feature disposed proximate one of the through-vias.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment, as examples. Semiconductor devices are typically fabricated by sequentially depositing insulating or dielectric layers, conductive layers, and semiconductive layers of material over a semiconductor substrate, and patterning the various material layers using lithography to form circuit components and elements thereon.

Dozens or hundreds of integrated circuits are typically manufactured on a single semiconductor wafer. The individual dies are singulated by sawing the integrated circuits along scribe lines. The individual dies are then packaged separately, in multi-chip modules, or in other types of packaging.

The semiconductor industry continues to improve the integration density of various electronic components (e.g., transistors, diodes, resistors, capacitors, etc.) by continual reductions in minimum feature size, which allow more components to be integrated into a given area. These smaller electronic components such as integrated circuit dies also require smaller packages that utilize less area than packages of the past, in some applications.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a cross-sectional view of a packaged semiconductor device in accordance with some embodiments of the present disclosure, wherein dummy features are formed in an interconnect structure of the package proximate a through-via region.

FIG. 2 is a top view illustrating a through-via region of a packaged semiconductor device in accordance with some embodiments.

FIG. 3 is a top view of a portion of a packaged semiconductor device that illustrates dummy features formed in through-via regions in accordance with some embodiments.

FIG. 4 is a top view of a portion of a packaged semiconductor device that illustrates some exemplary shapes and arrangements of dummy features formed in through-via regions in accordance with some embodiments.

FIG. 5 is a top view of a portion of a packaged semiconductor device that illustrates dummy features formed in through-via regions in accordance with some embodiments, wherein dummy features in adjacent through-via regions are coupled together.

FIGS. 6 through 11 are cross-sectional views illustrating a method of packaging a semiconductor device at various stages of a packaging process in accordance with some embodiments.

FIG. 12 is a cross-sectional view of a packaged semiconductor device that includes dummy features formed in a through-via region of an interconnect structure of the package in accordance with some embodiments.

FIG. 13 is a cross-sectional view of a packaged semiconductor device in accordance with some embodiments, wherein a first packaged semiconductor device is coupled to a second packaged semiconductor device.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

Embodiments of the present disclosure provide novel packages for semiconductor devices, methods of packaging semiconductor devices, and packaged semiconductor devices wherein dummy features are formed in an interconnect structure proximate through-vias of the package. The dummy features improve heat dissipation within the package.

Referring first to FIG. 1, a cross-sectional view of a portion of a packaged semiconductor device 100 in accordance with some embodiments of the present disclosure is shown. The packaged semiconductor device 100 includes dummy features 114 that are formed in a through-via region 110 of an interconnect structure 120 a of the package. Dummy features 114 a, 114 b, 114 c, and 114 d are labelled collectively as dummy features 114 in FIG. 1.

For example, region 110 of the interconnect structure 120 a comprises a through-via region 110. The through-via region 110 is disposed proximate a through-via 106 of the packaged semiconductor device. In the view shown in FIG. 1, the through-via region 110 is disposed over the through-via 106, for example. Alternatively, the through-via region 110 may be disposed under the through-via 106 in an interconnect structure, not shown. A portion of the through-via 106 may extend into the through-via region 110 in some embodiments, as shown. A portion of the through-via 106 may not extend into the through-via region 110 in other embodiments.

The dummy features 114 comprise a conductive material and are also referred to herein, e.g., in some of the claims, as dummy conductive features. The dummy features 114 are formed in the through-via region 110. Some conductive features of the interconnect structure 120 a are also formed in the through-via region 110 in some embodiments. In other embodiments, some conductive features of the interconnect structure 120 a are not formed in the through-via region 110.

The dummy features 114 are formed in one or more through-via regions 110 in some embodiments. The dummy features 114 are formed in through-via regions 110 having a low local density of conductive features of the interconnect structure 120 a. For example, in embodiments wherein an initial design of the package comprises conductive features in a through-via region 110 of about 50% or less, dummy features 114 are included in the through-via region 110 to achieve a local density of dummy features 114 or a combination of dummy features 114 and conductive features of the interconnect structure 120 a of about 50% or greater, in some embodiments.

The dummy features 114 are added in through-via region 110 above through-via 106 locations until the conductive feature and dummy feature 114 density of the interconnect structure 120 a above the through-via 106 locations is greater than or equal to about 50% in some embodiments.

The packaged semiconductor device 100 includes an integrated circuit die 102 that is packaged in a package that includes a plurality of the through-vias 106 and a material 116 disposed around and between the plurality of through-vias 106 the integrated circuit die 102. Only one through-via 106 is shown in FIG. 1; however, the packaged semiconductor device 100 may include dozens, hundreds, or thousands of through-vias 106 formed therein. The material 116 comprises an insulating material in some embodiments. The material 116 comprises a molding material or an underfill material in some of the embodiments shown in FIG. 1, for example. In other embodiments, the material 116 comprises an interposer substrate material, to be described further herein.

The integrated circuit die 102 is disposed in an integrated circuit mounting region 104 of the package. The integrated circuit mounting region 104 is disposed within the material 116 in the embodiments shown in FIG. 1. Alternatively, the integrated circuit mounting region 104 may be disposed in other locations of the package, to be described further herein.

In some embodiments, a package for a semiconductor device includes the interconnect structure 120 a that includes the dummy features 114. The interconnect structure 120 a is disposed over the plurality of through-vias 106, the integrated circuit die mounting region 104, and the material 116. The interconnect structure 120 a comprises a redistribution layer (RDL) or a post-passivation interconnect (PPI) structure in some embodiments. The interconnect structure 120 a may alternatively comprise other types of wiring structures. The interconnect structure 120 a comprises a plurality of conductive feature layers disposed proximate one of the plurality of through-vias, and the interconnect structure comprises a plurality of dummy features 114 in some embodiments. One or more of the plurality of dummy features 114 is disposed in one or more of the plurality of conductive feature layers of the interconnect structure 120 a in some embodiments, to be described further herein.

The interconnect structure 120 a comprises a first interconnect structure 120 a in some embodiments. A second interconnect structure 120 b is formed on an opposite side of the package than the side the first interconnect structure 120 a is formed on, in some embodiments. The first interconnect structure 120 a comprises a front side RDL, and the second interconnect structure 120 b comprises a back side RDL, in some embodiments.

The integrated circuit die 102 includes a plurality of contact pads 124 a formed on a surface thereof in some embodiments. The second interconnect structure 120 b include a plurality of contact pads 124 b formed on a surface thereof in some embodiments. The through-vias 106 may also include a contact pad 124 c formed on one end. In other embodiments, the through-vias 106 do not include contact pads 124 c formed on one end. The integrated circuit die 102 includes a plurality of contact pads 124 d formed on an opposite surface from the surface that the contact pads 124 a are formed on, in some embodiments. A passivation material 108 is disposed over the integrated circuit die 102 and portions of the contact pads 124 d in some embodiments. Portions of the interconnect structure 120 a are coupled to the contact pads 124 d of the integrated circuit die 102 through openings in the passivation material 108 in some embodiments. In other embodiments, the passivation material 108 is not included. Portions of the interconnect structure 120 a are coupled to the through-vias 106 in some embodiments.

The interconnect structure 120 a includes a plurality of insulating material layers 126 a, 126 b, 126 c, 126 d, 126 e, 126 f, 126 g, and 126 h in some embodiments. The insulating material layers 126 a, 126 b, 126 c, 126 d, 126 e, 126 f, 126 g, and 126 h are collectively labelled as insulating material layers 126 in FIG. 1. The insulating material layers 126 a, 126 b, 126 c, 126 d, 126 e, 126 f, 126 g, and 126 h comprise a polymer or other insulating materials. A plurality of conductive lines 128 is disposed within insulating material layers 126 a, 126 c, 126 e, and 126 g. A plurality of conductive vias 130 is disposed within insulating material layers 126 b, 126 d, and 126 f. Contact pads 124 e, an under-ball metallization (UBM) structure, and/or conductive traces 133 are formed over and/or within insulating material layer 126 h. The contact pads 124 e, UBM structure 132, and/or conductive traces 133 are coupled to the conductive lines 128 and/or vias 130. The conductive features of the interconnect structure 120 a comprising the conductive lines 128, vias 130, contact pads 124 e, UBM structure 132, and/or conductive traces 133 may comprise a conductive material such as Cu, Al, W, other metals, or alloys, combinations, or multiple layers thereof, as examples. The conductive features of the interconnect structure 120 a comprising the conductive lines 128, vias 130, contact pads 124 e, UBM structure 132, and/or conductive traces 133 are each formed in a conductive feature layer of the packaged semiconductor device 100. Alternatively, the interconnect structure 120 a may comprise other types of conductive features and may be comprised of other materials.

Connectors 122 (shown in phantom, e.g., in dashed lines in FIG. 1) are coupled to the contact pads 124 e, UBM structure 132, or conductive traces 133 in some embodiments. A plurality of the connectors 122 are coupled to the interconnect structure 120 a in some embodiments, for example. In other embodiments, the connectors 122 are not included in the packaged semiconductor device 100. The connectors 122 comprise a eutectic material and may comprise connectors formed in a ball grid array (BGA) arrangement in some embodiments, for example.

The second interconnect structure 120 b also includes insulating material layers 126′, conductive lines 128′, vias 130′, and contact pads 124 b, and may also include UBM structures (not shown) and/or conductive traces (also not shown) as described for the first interconnect structure 120 a. The second interconnect structure 120 b is disposed beneath the plurality of through-vias 106, the integrated circuit die 102 in the integrated circuit die mounting region 104, and the material 116. In some embodiments, the through-via 106 is coupled to a contact pad 124 b by a via 130′ and conductive line 128′ of the second interconnect structure 120 b.

The second interconnect structure 120 b shown in FIG. 1 includes one conductive line 128′ layer and one via 130′ layer. Alternatively, the second interconnect structure 120 b may comprise two or more conductive line 128′ layers and two or more via 130′ layers. Likewise, the first interconnect structure 120 a may include one or more conductive line 128 layers and one or more via 130 layers, in some embodiments.

The dummy features 114 advantageously provide improved thermal dissipation for the package. For example, openings for portions of contact pads 124 b in insulating material layers 126′ of the second interconnect structure 120 b may be formed in some embodiments using a thermal process, such as a laser. Heat may also be generated in the package when a solder-on-pad (SOP) process is used for forming connectors on contact pads of the interconnect structures, for example. The presence of the dummy features 114 provides thermal dissipation during the thermal patterning process for the insulating material layers 126′, for connector formation, and other processes, as examples.

The dummy features 114 are advantageously formed in the same material layers that conductive features of the packaged semiconductor device 100 are formed in. For example, dummy features 114 a are formed in the same conductive feature layer that conductive lines 128 are formed in insulating material layer 126 c, and dummy features 114 b are formed in the same conductive feature layer that vias 130 are formed in insulating material layer 126 f in FIG. 1. Similarly, dummy features 114 c are formed in the same conductive feature layer that conductive lines 128 are formed in insulating material layer 126 g, and dummy features 114 d are formed in the same conductive feature layer that contact pads 124 e are formed in insulating material layer 126 h. Likewise, dummy features 114 may also be formed in the same conductive feature layers that conductive lines 128 are formed in insulating material layers 126 a and 126 e, and dummy features 114 may also be formed in the same conductive feature layers that vias 130 are formed in insulating material layers 126 b and 126 d, not shown, as examples. Thus, no additional processing steps are required to include the dummy features 114 in the package. Existing lithography masks and packaging processes for the conductive features of the interconnect structure 120 a can advantageously be modified to include the dummy features 114 in the packaged semiconductor device 100.

The conductive feature layer of the interconnect structure 120 a that the dummy features 114 may be formed in may comprise one or more conductive line layers, via layers, contact pad layers, conductive trace layers, or UBM layers in some embodiments, for example. Alternatively, the dummy features 114 may be formed in other types of material layers of the interconnect structure 120 a proximate the through-via region 110.

Because the dummy features 114 are formed in the same material layer that conductive features in a conductive feature layer of the interconnect structure 120 a are formed in, the dummy features 114 comprise the same material as the conductive features in the conductive feature layer of the interconnect structure 120 a in some embodiments.

The through-vias 106 comprise a width or diameter comprising dimension d₁, wherein dimension d₁ comprises about 140 μm to about 300 μm in some embodiments. Dimension d₁ is also referred to herein, e.g., in some of the claims, as a first width. The through-via region 110 of the interconnect structure 120 a comprises a width comprising dimension d₂. Dimension d₂ is also referred to herein, e.g., in some of the claims, as a second width. Dimension d₂ comprises about (1.5*d₁) in some embodiments, for example. Dimension d₂ is substantially equal to or about equal to (1.5*d₁) in some embodiments. In other embodiments, dimension d₂ may comprise about (1*d₁) to about (2*d₁), as other examples. Alternatively, dimensions d₁ and d₂ may comprise other dimensions and other relative dimensions. The second width of the through-via region 110 is at least the same width or larger than the first width of the through-via 106, in order to provide sufficient heat dissipation for thermally conductive properties of the through-via 106 and other portions of the packaged semiconductor device 100 in some embodiments, for example.

The through-vias 106 comprise a substantially circular shape in a top view of the packaged semiconductor device 100 in some embodiments, as shown in FIG. 2. Alternatively, the through-vias 106 may comprise other shapes, such as oval, square, rectangular, or other shapes in the top view. The through-via region 110 comprises a substantially square shape in the top view, also shown in FIG. 2. The through-via region 110 may alternatively comprise other shapes, such as rectangular, circular, oval, or other shapes in the top view. In some embodiments, the through-via region 110 comprises a square shape that is substantially concentric with a through-via 106, for example.

Referring again to FIG. 1, the through-via region 110 is spaced apart from an edge 142 of the packaged semiconductor device 100 by an amount comprising dimension d₃. Dimension d₃ comprises about 20 μm or greater in some embodiments, for example. Alternatively, dimension d₃ may comprise other values.

FIG. 3 is a top view of a portion of a packaged semiconductor device 100 that illustrates dummy features 114 formed in through-via regions 110 of an interconnect structure 120 a in accordance with some embodiments. A corner portion of the packaged semiconductor device 100 is shown. Dummy features 114 are included proximate through-via regions 110. Dummy features 114 are including within the through-via region 110 that are disposed within the interconnect structure 120 a proximate the through-vias 106, for example. Dummy features 114 are not included proximate through-via regions 110′.

Portions of the dummy features 114 are formed directly over the through-vias 106. Other portions of the dummy features 114 are not formed directly over the through-vias 106, but are formed directly over material 116 (see FIG. 1) proximate and adjacent the through-vias 106.

In order to determine which through-via regions 110 or 110′ to include the dummy features 114 in the design, an analysis of the local density (e.g., within each through-via region 110 or 110′ proximate a through-via 106 or 106′) of conductive lines 128 and 128′ in an original design for conductive feature layer or layers is performed. If the local density of conductive lines 128 is less than 50%, as is the case in through-via regions 110 in FIG. 3 (which can be seen in the top view of FIG. 3), the dummy lines 114 are included in the interconnect region 120 a in the through-via region 110. An adequate size and/or number of dummy lines 114 is included in each of the through-via regions 110 to achieve a local density of about 50% or greater of either: a) dummy lines 114; or b) both the dummy lines 114 and conductive lines 128, in accordance with some embodiments.

For example, in some embodiments, a plurality of dummy conductive features 114 is included in the packaged semiconductor device 100, and the interconnect structure comprises a plurality of conductive features (i.e., conductive lines 128, vias 130, contact pads 124 e, UBM structures 132, and/or conductive traces 133). Forming the plurality of dummy conductive features 114 and forming the plurality of conductive features 128, 130, 124 e, 132, and/or 133 comprises forming one or more of the plurality of dummy conductive features 114 and one or more of the plurality of conductive features 128, 130, 124 e, 132, and/or 133 such that each of the through-via regions 110 comprises a density of about 50% or greater of the one or more of the plurality of dummy conductive features 114, or about 50% or greater of the one or more of the plurality of dummy conductive features 114 and the one or more of the plurality of conductive features 128, 130, 124 e, 132, and/or 133 in some embodiments.

In through-via regions 110′, the local density of the conductive lines 128′ is greater than 50%, and dummy lines 114 are not required or included in the through-via regions 110′, for example. Conductive lines 128′ are larger in the top view than conductive lines 128 in FIG. 3. Alternatively, a greater number of conductive lines 128′ may be disposed in through-via regions 110′ (not shown), which would create a local density of the conductive lines 128′ of greater than 50%, and which would also not require dummy lines 114 to be included in the through-via regions 110′, as another example, in accordance with some embodiments of the present disclosure.

The arrangement and locations of the through-via regions 110 and 110′ illustrated in FIG. 3 is merely an example. Alternatively, the through-via regions 110 that include dummy features 114 may be located in other regions of a packaged semiconductor device 100, and may be arranged in other patterns and shapes.

The dummy features 114 are spaced apart along their length by a predetermined distance from conductive features formed in the same conductive feature layer in some embodiments. The dummy features 114 may be spaced apart from conductive features formed in the same conductive feature layer by about a width of a dummy feature or greater, as an example. The dummy features 114 may comprise substantially the same width as conductive features formed in the same conductive feature layer, or the dummy features 114 may comprise a different width as conductive features formed in the same conductive feature layer. Alternatively, the dummy features 114 may comprise other spacing dimensions and relative width dimensions with respect to conductive features formed in the same conductive feature layer.

FIG. 4 is a top view of a portion of a packaged semiconductor device 100 that illustrates some exemplary shapes and arrangements of dummy features 114 formed in through-via regions 110 of an interconnect structure 120 a in accordance with some embodiments. In through-via region 110′, the conductive line 128′ fills over 50% of the through-via region 110′ (e.g., has a local density of over 50%), and dummy features 114 are thus not included in through-via region 110′. In through-via region 110 a, the conductive line 128 fills less than 50% of the through-via region 110 a, and thus, dummy features 114 are included in the through-via region 110 a. Two dummy features 114 are included in through-via region 110 a in the example shown. Alternatively, one dummy feature 114, or three or more dummy features 114 may be included in a through-via region 110 or 110 a. The dummy features 114 comprise substantially square or rectangular shapes in the top view. Alternatively, the dummy features 114 may comprise other shapes. The two dummy features 114 comprise two isolated dummy features 114 formed in a conductive feature layer of the interconnect structure 120 a that do not intersect in through-via region 110 a. The dummy features 114 may be formed in two different conductive feature layers of the interconnect structure 120 a, as another example.

In through-via region 110 b, the conductive line 128 fills less than 50% of the through-via region 110 b, and thus, a dummy feature 114′ is included in the through-via region 110 a. The dummy feature 114′ may comprise two dummy features that intersect in some embodiments. The dummy feature 114′ comprises a shape of a letter T. The dummy feature 114′ may alternatively comprise other shapes, such as L-shaped, meandering patterns, or irregular shapes, or combinations of square, rectangular and/or other shapes in the top view. Alternatively, the dummy feature 114′ may comprise other shapes. Combinations of one or more dummy features 114 and 114′ may also be included in a single through-via region 110, 110 a, or 110 b of an interconnect structure 120 a.

FIG. 5 is a top view of a portion of a packaged semiconductor device 100 that illustrates a dummy feature 114″ formed in through-via regions 110 c and 110 d in accordance with some embodiments, wherein dummy features 114 of adjacent through-via regions 110 c and 110 d are coupled together. The dummy features 114 are coupled together by a segment 115 of conductive material, forming a dummy feature 114″ that extends between and into the through-via regions 110 c and 110 d.

The dummy features 114, 114′, and 114″ are not coupled to a conductive line 128 or other conductive feature of the interconnect structure 120 a in some embodiments. In other embodiments, at least one dummy feature 114, 114′, or 114″ may be coupled to a conductive line 128 or other conductive feature of the interconnect structure 120 a (see the right-most dummy feature 114 a in FIG. 1). The dummy features 114, 114′, or 114″ may be formed in the same conductive feature layer that conductive lines 128 are formed in. The dummy features 114, 114′, or 114″ may be formed in a different conductive feature layer that conductive lines 128 are formed in. The dummy features 114, 114′, or 114″ may be formed in the same conductive feature layer that conductive lines 128 are formed in and also one or more different conductive feature layers that conductive lines 128 are formed in, as another example.

FIGS. 4 and 5 also illustrate that the dummy features 114, 114′, and 114″ can extend to an exterior of the through-via regions 110 in some embodiments. In some embodiments, the dummy features 114, 114′, and 114″ do not change electrical connection properties within each conductive feature layer, for example. The dummy features 114 are not coupled to dummy features 114 in neighboring (e.g., adjacent or proximate) through-via regions 110, 110 a, or 110 b in some embodiments, as shown in FIG. 4. The dummy features 114 are not connected in neighboring through-via regions 110, 110 a, or 110 b in embodiments wherein conductive features in the original conductive feature layer design were not connected together, for example. In other embodiments, the dummy features 114 can connect to dummy features 114 in neighboring through-via regions 110, as shown in FIG. 5 at 114″. The dummy features 114 can be connected in neighboring through-via regions 110, 110 c, and 110 d (e.g., by a conductive segment 115) in embodiments wherein conductive features in the original conductive feature layer design were connected together, for example.

Referring again to FIGS. 1, 3, 4, and 5, in accordance with some embodiments of the present disclosure, a packaged semiconductor device 100 includes a molding material 116, a plurality of through-vias 106 disposed within the molding material 116, and an integrated circuit die 102 disposed within the molding material 116. An interconnect structure 120 a is disposed over the molding material 116, the plurality of through-vias 106, and the integrated circuit die 102. The interconnect structure 120 a includes a conductive feature layer (e.g., including a conductive feature 128, 130, 124 e, 132, or 133) and a through-via region 110 proximate one of the plurality of through-vias 106. The through-via region 110 of the interconnect structure 120 a includes a dummy conductive feature 114 disposed in the conductive feature layer. In some embodiments, the through-via region 110 comprises a first through-via region, and the dummy conductive feature 114 comprises a first dummy conductive feature. The one of the plurality of through-vias 106 comprises a first one of the plurality of through-vias. The interconnect structure 120 a includes a second through-via region proximate a second one of the plurality of through-vias 106, and the second through-via region includes a second dummy conductive feature formed therein (see FIGS. 4 and 5). The second dummy conductive feature is coupled to the first dummy conductive feature in some embodiments (FIG. 5), or the second dummy conductive feature is not coupled to the first dummy conductive feature in other embodiments (FIG. 4). In some embodiments, the second dummy conductive feature is formed in the conductive feature layer (FIG. 1). In other embodiments, the conductive feature layer comprises a first conductive feature layer, and the interconnect structure 120 a comprises a second conductive feature layer. The second dummy conductive feature is formed in the second conductive feature layer (FIG. 1). In some embodiments, the second through-via region is disposed adjacent or proximate the first through-via region (FIGS. 4 and 5).

FIGS. 6 through 11 are cross-sectional views illustrating a method of packaging a semiconductor device at various stages in accordance with some embodiments of the present disclosure. In FIG. 6, a carrier 101 a is provided. The carrier 101 a comprises a first carrier 101 a in some embodiments. The carrier 101 a may comprise glass, silicon oxide, aluminum oxide, or a semiconductor wafer, as examples. The carrier 101 a may also comprise other materials.

A plurality of through-vias 106 are formed over the first carrier 101 a. The through-vias 106 may be formed using subtractive techniques, damascene techniques, plating, or other methods. For example, in a subtractive technique, a conductive material such as Cu, a Cu alloy, other metals, or combinations or multiple layers thereof may be formed over an entire surface of the first carrier 101 a, and the conductive material is patterned to form the through-vias 106. The conductive material may be patterned using photolithography, by forming a layer of photoresist over the conductive material, exposing the layer of photoresist to light or energy reflected from or transmitted through a lithography mask having a desired pattern thereon, and developing the layer of photoresist. Exposed (or unexposed, depending on whether the layer of photoresist is positive or negative) portions of the layer of photoresist are then ashed and removed. The patterned layer of photoresist is then used as an etch mask during an etch process for the conductive material. The layer of photoresist is then removed, leaving the conductive material patterned with the desired pattern of the through-vias 106.

As another example, the through-vias 106 may be formed using a plating process. A seed layer (not shown) is formed over the first carrier 101 a, and a sacrificial layer such as an insulating material or photoresist is formed over the seed layer. The sacrificial layer is then patterned using photolithography with the desired pattern of the through-vias 106, and a plating process is used to plate a conductive material such as Cu, a Cu alloy, or other metals over the seed layer. The sacrificial layer is then removed.

Referring next to FIG. 7, an integrated circuit die 102 is provided. The integrated circuit die 102 may be previously fabricated on a semiconductor wafer and singulated along scribe lines to form individual integrated circuit dies 102, for example. The integrated circuit die 102 may comprise a logic chip, a memory chip, a processor, an application specific device, or a chip having other functions, as examples. Only one integrated circuit die 102 is shown in the drawings; however, a plurality of integrated circuit dies 102 may be packaged over the carrier 101 a simultaneously, and the packaged devices are later singulated to form individually packaged dies 102 or a plurality of dies 102 packaged together in a single package.

The integrated circuit die 102 is coupled to the first carrier 101 a manually or using an automated machine such as a pick-and-place machine, as shown in FIG. 7. The integrated circuit die 102 is coupled to the first carrier 101 a in the integrated circuit die mounting region 104 using an adhesive or a die attach film (DAF), not shown. In some embodiments, one integrated circuit die 102 is coupled to the first carrier 101 a and is packaged using the techniques described herein. In other embodiments, two or more integrated circuit dies 102 may be coupled to the first carrier 101 a and packaged together in a single packaged semiconductor device 100 (not shown in the drawings). A plurality of integrated circuit dies 102 comprising the same or different functions may be packaged together in accordance with some embodiments, for example. One or more types of integrated circuit dies 102 may be packaged in a single packaged semiconductor device 100 to form a system on a chip (SoC) device in some embodiments, for example.

The packaging step shown in FIG. 7 may be performed before the packaging step shown in FIG. 6 in some embodiments. For example, the integrated circuit die 102 may first be coupled to the first carrier 101 a, and the through-vias 106 may then be formed over the first carrier 101 a.

Material 116 is formed over the first carrier 101 a over the through-vias 106 and the integrated circuit die 102, as shown in FIG. 8. As applied, the material 116 may extend over a top surface of the die 102 and the through-vias 106 in some embodiments, as shown in phantom at 116′. The material 116 comprises an underfill material or molding material in the embodiments shown in FIG. 8. The material 116 is formed around the integrated circuit die 102, around the plurality of through-vias 106, and between the through-vias 106 and integrated circuit die 102. The material 116 may be molded using compressive molding, transfer molding, or other methods. The material 116 encapsulates the integrated circuit dies 102 and the through-vias 106, for example. The material 116 may comprise an epoxy, an organic polymer, or a polymer with or without a silica-based or glass filler added, as examples. In some embodiments, the material 116 comprises a liquid molding compound (LMC) that is a gel type liquid when applied. Alternatively, the material 116 may comprise other insulating and/or encapsulating materials, or other materials.

In some embodiments, the material 116 is applied so that it extends to top surfaces of the integrated circuit dies 102. The top surface of the material 116 is substantially coplanar with top surfaces of the integrated circuit dies 102 and the through-vias 106 in some embodiments, for example, as shown in FIG. 8.

If the material 116 extends over top surfaces of the integrated circuit dies 102 and the through-vias 106 after the material 116 is applied, as shown in FIG. 8 at 116′, the material 116 is removed from over the top surfaces of the integrated circuit dies 102 and the through-vias 106 using a chemical-mechanical polish (CMP) process, an etch process, other methods, or combinations thereof, in some embodiments, for example, as shown in FIG. 8. The material 116 is left remaining between and around the integrated circuit dies 102 and the through-vias 106.

Next, the material 116 is cured using a curing process in some embodiments. The curing process may comprise heating the material 116 to a predetermined temperature for a predetermined period of time, using an anneal process or other heating process. The curing process may also comprise an ultra-violet (UV) light exposure process, an infrared (IR) energy exposure process, combinations thereof, or a combination thereof with a heating process. Alternatively, the material 116 may be cured using other methods. In some embodiments, a curing process is not required for the material 116.

An interconnect structure 120 a including one or more dummy features 114 described herein is formed over a first side 174 of the integrated circuit die 102, the plurality of through-vias 106, and the material 116 in some embodiments, as shown in FIG. 9. (The details of the dummy features 114 are not shown in FIG. 9 through 13; refer to FIG. 1 and FIGS. 3 through 5). The first side 174 comprises a front side of the packaged semiconductor device 100 in some embodiments, for example. The interconnect structure 120 a comprises one or more insulating material layers and conductive features formed in the insulating material layers (not shown in FIG. 9; see insulating material layers 126 a, 126 b, 126 c, 126 d, 126 e, 126 f, 126 g, and 126 h comprising a polymer and conductive features comprising conductive lines 128, vias 130, contact pads 124 e, UBM structures 132, and conductive traces 133 comprising Cu, Al, W, other metals, or combinations or multiple layers thereof shown in FIG. 1). The interconnect structure 120 a may be formed using one or more subtractive etch processes or damascene processes, for example. The interconnect structure 120 a comprises a first interconnect structure 120 a in some embodiments.

A dummy conductive feature 114 is formed in the through-via region 110 (see FIG. 1) of the interconnect structure 120 a in a conductive feature layer of the interconnect structure 120 a in some embodiments. The dummy conductive feature 114 is formed simultaneously with the formation of the conductive feature layer of the interconnect structure 120 a that the dummy conductive feature 114 is formed in, in some embodiments, for example.

In some embodiments, after the interconnect structure 120 a is formed, the carrier 101 a is removed, and the packaging process for the packaged semiconductor device 100 is complete. A plurality of the packaged semiconductor devices 100 are then singulated using a saw blade or laser along scribe lines.

In other embodiments, a plurality of connectors 122 is formed on the interconnect structure 120 a, also shown in FIG. 9. The connectors 122 are formed on contact pads or UBM structures of the interconnect structure 120 a, for example (see FIG. 1). The connectors 122 comprise a eutectic material such as solder, and may comprise solder balls or solder paste in some embodiments. The connectors 122 may include other types of electrical connectors, such as microbumps, controlled collapse chip connection (C4) bumps, or pillars, and may include conductive materials such as Cu, Sn, Ag, Pb, or the like.

In some embodiments, after the connectors 122 are formed, the carrier 101 a is removed, and the packaging process for the packaged semiconductor device 100 is complete. A plurality of the packaged semiconductor devices 100 are then singulated using a saw blade or laser along scribe lines.

In other embodiments, a second carrier 101 b is coupled to the connectors 122 and to the interconnect structure 120 a, as shown in FIG. 10. The second carrier 101 b may be coupled to the connectors 122 and/or to the interconnect structure 120 a using a temporary adhesive 172, for example. The first carrier 101 a is then removed, also shown in FIG. 10.

In some embodiments, a second interconnect structure 120 b is then formed on a second side 176 of the integrated circuit die 102, the through-vias 106, and the material 116, as shown in FIG. 11. The second side 176 is opposite the first side 174. The second side 176 comprises a back side of the packaged semiconductor device 100 in some embodiments, for example. The second interconnect structure 120 b comprises similar materials and features as described for the first interconnect structure 120 a, for example.

A plurality of connectors 158 is coupled to the second side 176 of the packaged semiconductor device 100 in some embodiments, also shown in FIG. 11. The connectors 158 are coupled to portions of the second interconnect structure 120 b in some embodiments, such as contact pads (not shown), for example. The connectors 158 comprise similar materials and formation methods as described for connectors 122 in some embodiments, for example. The second carrier 101 b and adhesive 172 are then removed or debonded from a plurality of the packaged semiconductor devices 100, and the packaged semiconductor devices 100 are then singulated using a saw blade or laser along scribe lines.

The packaged semiconductor devices 100 can then be electrically and mechanically coupled to another packaged semiconductor device, to a printed circuit board (PCB), or in an end application or to another object using the connectors 122 and/or 158.

FIG. 12 is a cross-sectional view of a packaged semiconductor device 100′ that includes at least one dummy feature 114 formed in a through-via region 110 of an interconnect structure 120 a of the package in accordance with some embodiments. The through-vias 106 comprise through-interposer vias (TIVs) in the embodiments shown, for example. Material 116 comprises an interposer substrate material in some of the embodiments shown in FIG. 12. The material 116 comprises a package substrate in some embodiments, for example. The material 116 comprises a substrate comprising a semiconductor material, glass fiber, resin, a filler, other materials, and/or combinations thereof, in some embodiments, for example. The material 116 may comprise a glass substrate or a polymer substrate, as other examples. The material 116 may comprise a substrate that includes one or more passive components (not shown) embedded inside.

The integrated circuit mounting region 104 is disposed over the interconnect structure 120 a in some of the embodiments shown in FIG. 12. An integrated circuit die 102 is coupled over an interconnect structure 120 a of the packaged semiconductor device 100′ in the embodiments shown, for example. The integrated circuit mounting region 104 is disposed proximate a surface of an interconnect structure 120 a or 120 b in some embodiments, for example. The integrated circuit die 102 is coupled to an integrated circuit mounting region 104 on an interconnect structure 120 a that is disposed over material layer 116, for example. Alternatively, an integrated circuit die 102 may be coupled to material 116, not shown.

FIG. 13 is a cross-sectional view of a packaged semiconductor device 170 in accordance with some embodiments, wherein a packaged semiconductor device 100 described herein is coupled to another packaged semiconductor device 150. The packaged semiconductor device 100 comprises a first packaged semiconductor device 100 in some embodiments, and the first packaged semiconductor device 100 is coupled to a second packaged semiconductor device 150 by a plurality of connectors 158. The connectors 158 which may comprise solder balls or other materials are coupled between contact pads of the first packaged semiconductor device 100 and contact pads of the second packaged semiconductor device 150, for example. Some contact pads are coupled to the integrated circuit die 102 and some of the contact pads are coupled to the through-vias 106, in some embodiments. In some embodiments, the packaged semiconductor device 170 comprises a package-on-package (PoP) device, for example.

The packaged semiconductor device 100 includes a plurality of the through-vias 106 formed within the material 116. The through-vias 106 provide vertical connections for the packaged semiconductor device 100. The interconnect structures 120 a and 120 b provide horizontal electrical connections for the packaged semiconductor device 100. Packaged semiconductor device 150 also includes an interconnect structure 120 c that provides horizontal electrical connections for the packaged semiconductor device 150. Interconnect structure 120 c is coupled to interconnect structure 120 b by a plurality of connectors 158.

The second packaged semiconductor device 150 includes one or more integrated circuit dies 156 coupled to a substrate 154. In some embodiments, the dies 156 comprise memory chips. For example, the dies 156 may comprise dynamic random access memory (DRAM) devices in some embodiments. Alternatively, the dies 156 may comprise other types of chips. Wire bonds 152 may be coupled to contact pads on a top surface of the integrated circuit die or dies 156, which are coupled to bond pads on the substrate 154. The wire bonds 152 provide vertical electrical connections for the packaged semiconductor device 150 in some embodiments, for example. A molding material 148 may be disposed over the wire bonds 152, the integrated circuit die or dies 156, and the substrate 154.

Alternatively, a PoP device 170 may include two packaged semiconductor devices 100 described herein that are coupled together in some embodiments, not shown in the drawings. In some embodiments, the PoP device 170 may comprise a system-on-a-chip (SOC) device, as another example.

In some embodiments, an insulating material 160 is disposed between the packaged semiconductor devices 100 and 150 between the connectors 158, as shown in phantom (e.g., in dashed lines) in FIG. 13. The insulating material 160 may comprise an underfill material or a molding material, as examples. Alternatively, the insulating material 160 may comprise other materials, or the insulating material 160 may not be included.

Some embodiments of the present disclosure include packages for semiconductor devices, and methods of packaging semiconductor devices. Other embodiments include packaged semiconductor devices 100 and 100′ that have been packaged using the novel methods described herein.

Some advantages of embodiments of the present disclosure include providing novel packaging structures and methods wherein dummy features are fabricated in interconnect structures of a package proximate through-via regions of the interconnect structures. The novel dummy features advantageously provide heat dissipation during various processing steps of the packaged semiconductor device, and also during device operation. The dummy features dissipate any heat generated within or outside of the packages, which could cause package deformation, connector (e.g., solder ball) deformation, or other issues.

No additional packaging process steps, lithography masks, lithography processes, or costs are required to include the dummy features in semiconductor device packages. A design rule for dummy pattern inclusion into conductive feature layers of interconnect structures in through-via regions can be defined, and the dummy feature patterns can be generated on lithography masks used for the formation and patterning of conductive feature layers, in order to provide heat dissipation in the through-via regions, for example.

The dummy features can be included in low density areas of interconnects for improved heat dissipation. Forming the dummy features in through-via regions proximate the through-vias is advantageous because the through-vias can transfer heat within the package, for example. The dummy features are adapted to dissipate heat transferred by the through-vias, which is particularly advantageous in areas of interconnect structures that have a low density of conductive features. Furthermore, the dummy conductive features and novel packaging methods and structures described herein are easily implementable in manufacturing and packaging process flows.

In some embodiments, a package for a semiconductor device includes a plurality of through-vias, an integrated circuit die mounting region, and a material disposed around and between the plurality of through-vias and the integrated circuit die mounting region. An interconnect structure is disposed over the material, the plurality of through-vias, and the integrated circuit die mounting region. The interconnect structure comprises a dummy feature disposed proximate one of the plurality of through-vias.

In some embodiments, a packaged semiconductor device includes a molding material, a plurality of through-vias disposed within the molding material, and an integrated circuit die disposed within the molding material. An interconnect structure is disposed over the molding material, the plurality of through-vias, and the integrated circuit die. The interconnect structure comprises a conductive feature layer and a through-via region proximate one of the plurality of through-vias. The through-via region includes a dummy conductive feature disposed in the conductive feature layer.

In other embodiments, a method of packaging a semiconductor device includes forming a plurality of through-vias over a carrier, coupling an integrated circuit die to the carrier, and forming a molding material around the plurality of through-vias and the integrated circuit die. The method includes forming an interconnect structure over the molding material, the plurality of through-vias, and the integrated circuit die. The interconnect structure includes a through-via region disposed over one of the plurality of through-vias. A dummy conductive feature is formed in the through-via region of the interconnect structure in a conductive feature layer of the interconnect structure. The carrier is removed.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. 

What is claimed is:
 1. A package for a semiconductor device, comprising: a plurality of through-vias; an integrated circuit die mounting region; a material disposed around and between the plurality of through-vias and the integrated circuit die mounting region; and an interconnect structure disposed over the material, the plurality of through-vias, and the integrated circuit die mounting region, wherein the interconnect structure comprises a dummy feature disposed proximate one of the plurality of through-vias.
 2. The package according to claim 1, wherein the integrated circuit mounting region is disposed proximate a surface of the interconnect structure.
 3. The package according to claim 2, wherein the material comprises an interposer substrate material.
 4. The package according to claim 1, wherein the integrated circuit die mounting region is disposed within the material.
 5. The package according to claim 4, wherein the material comprises a molding material or an underfill material.
 6. The package according to claim 1, wherein the interconnect structure comprises a plurality of conductive feature layers disposed proximate the one of the plurality of through-vias, wherein the interconnect structure comprises a plurality of dummy features, and wherein one or more of the plurality of dummy features is disposed in one or more of the plurality of conductive feature layers of the interconnect structure.
 7. A packaged semiconductor device, comprising: a molding material; a plurality of through-vias disposed within the molding material; an integrated circuit die disposed within the molding material; and an interconnect structure disposed over the molding material, the plurality of through-vias, and the integrated circuit die, wherein the interconnect structure comprises a conductive feature layer and a through-via region proximate one of the plurality of through-vias, and wherein the through-via region includes a dummy conductive feature disposed in the conductive feature layer.
 8. The packaged semiconductor device according to claim 7, wherein the conductive feature layer comprises a conductive line layer, a via layer, a contact pad layer, a conductive trace layer, or an under-ball metallization (UBM) layer.
 9. The packaged semiconductor device according to claim 7, wherein the through-via region comprises a first through-via region, wherein the dummy conductive feature comprises a first dummy conductive feature, wherein the one of the plurality of through-vias comprises a first one of the plurality of through-vias, wherein the interconnect structure includes a second through-via region proximate a second one of the plurality of through-vias, and wherein the second through-via region includes a second dummy conductive feature formed therein.
 10. The packaged semiconductor device according to claim 9, wherein the second dummy conductive feature is coupled to the first dummy conductive feature.
 11. The packaged semiconductor device according to claim 9, wherein the second dummy conductive feature is not coupled to the first dummy conductive feature.
 12. The packaged semiconductor device according to claim 9, wherein the second dummy conductive feature is formed in the conductive feature layer.
 13. The packaged semiconductor device according to claim 9, wherein the conductive feature layer comprises a first conductive feature layer, wherein the interconnect structure comprises a second conductive feature layer, and wherein the second dummy conductive feature is formed in the second conductive feature layer.
 14. The packaged semiconductor device according to claim 9, wherein the second through-via region is disposed adjacent or proximate the first through-via region.
 15. A package-on-package (PoP) device including the packaged semiconductor device according to claim 7, wherein the packaged semiconductor device comprises a first packaged semiconductor device, and wherein the PoP device includes a second packaged semiconductor device coupled to the first packaged semiconductor device by a plurality of connectors.
 16. A method of packaging a semiconductor device, the method comprising: forming a plurality of through-vias over a carrier; coupling an integrated circuit die to the carrier; forming a molding material around the plurality of through-vias and the integrated circuit die; forming an interconnect structure over the molding material, the plurality of through-vias, and the integrated circuit die, the interconnect structure comprising a through-via region disposed over one of the plurality of through-vias; forming a dummy conductive feature in the through-via region of the interconnect structure in a conductive feature layer of the interconnect structure; and removing the carrier.
 17. The method according to claim 16, wherein forming the interconnect structure comprises forming a redistribution layer (RDL) or a post-passivation interconnect (PPI) structure.
 18. The method according to claim 16, wherein forming the interconnect structure comprises forming a plurality of conductive features in the conductive feature layer of the interconnect structure, wherein the one of the plurality of through-vias comprises a first width comprising dimension d₁, wherein the through-via region comprises a second width comprising dimension d₂, and wherein dimension d₂ is about (1.5*d₁).
 19. The method according to claim 16, wherein forming the dummy conductive feature comprises forming a plurality of dummy conductive features, wherein forming the interconnect structure comprises forming a plurality of conductive features, wherein forming the plurality of dummy conductive features and forming the plurality of conductive features comprises forming one or more of the plurality of dummy conductive features and one or more of the plurality of conductive features such that the through-via region comprises a density of about 50% or greater of the one or more of the plurality of dummy conductive features or about 50% or greater of the one or more of the plurality of dummy conductive features and the one or more of the plurality of conductive features.
 20. The method according to claim 16, wherein the carrier comprises a first carrier, wherein forming the interconnect structure comprises forming a first interconnect structure over a first side of the packaged semiconductor device, and wherein the method further comprises: first, coupling a second carrier to the first interconnect structure; second, removing the first carrier; third, forming a second interconnect structure over a second side of the packaged semiconductor device, wherein the second side of the packaged semiconductor device is opposite the first side of the packaged semiconductor device; and fourth, removing the second carrier. 